Kinetics of Curing of Epoxy Oligomer by Diaminodiphenyl Sulfone: Rheology and Calorimetry

Diaminodiphenyl sulfone is used as a curing agent to obtain an epoxy-resin-based binder with improved thermal stability. The kinetics of curing of this composition is studied by rheokinetic and calorimetric methods. It is shown that complete conversion is attained at a temperature of 200°С or higher...

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Bibliographic Details
Published in:Polymer science. Series A, Chemistry, physics Chemistry, physics, 2018-09, Vol.60 (5), p.683-690
Main Authors: Arinina, M. P., Kostenko, V. A., Gorbunova, I. Yu, Il’in, S. O., Malkin, A. Ya
Format: Article
Language:English
Subjects:
Chemistry
Chemistry and Materials Science
Polymer Sciences
Rheology
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Summary:Diaminodiphenyl sulfone is used as a curing agent to obtain an epoxy-resin-based binder with improved thermal stability. The kinetics of curing of this composition is studied by rheokinetic and calorimetric methods. It is shown that complete conversion is attained at a temperature of 200°С or higher. The rate of viscosity increase in the course of time in curing under flow conditions does not depend on the shear rate; the viscosity changes monotonically. The curing reaction occurs in the homogeneous mode without separation of a crosslinked polymer; it is described by a second-order equation with self-deceleration at low temperatures. The rheokinetic characteristics and temperature dependences of kinetic parameters of the process are determined.
ISSN:0965-545X
1555-6107
DOI:10.1134/S0965545X18050012