Loading…
Mechanism of copper underpotential deposition at Pt(hkl)-electrodes: Quantum-chemical modelling
Mechanism of copper underpotential deposition at stepped faces of platinum single crystals Pt( hkl ) is studied using cyclic voltammetry, scanning probe microscopy, and quantum-chemical modelling. It is shown that the first stage of UPD is one-dimensional decoration of the (100)- or (110)-orientated...
Saved in:
Published in: | Russian journal of electrochemistry 2008-06, Vol.44 (6), p.697-708 |
---|---|
Main Authors: | , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
cited_by | cdi_FETCH-LOGICAL-c288t-76ba63bc94fba3135219c5e587f5402be4689e615bb1c7aa57fdc176690577793 |
---|---|
cites | cdi_FETCH-LOGICAL-c288t-76ba63bc94fba3135219c5e587f5402be4689e615bb1c7aa57fdc176690577793 |
container_end_page | 708 |
container_issue | 6 |
container_start_page | 697 |
container_title | Russian journal of electrochemistry |
container_volume | 44 |
creator | Danilov, A. I. Nazmutdinov, R. R. Zinkicheva, T. T. Molodkina, E. B. Rudnev, A. V. Polukarov, Yu. M. Feliu, J. M. |
description | Mechanism of copper underpotential deposition at stepped faces of platinum single crystals Pt(
hkl
) is studied using cyclic voltammetry, scanning probe microscopy, and quantum-chemical modelling. It is shown that the first stage of UPD is one-dimensional decoration of the (100)- or (110)-orientated steps, then copper monolayer forms at (111)-terraces. The final stage is the secondary step decoration. Quantum-chemical modelling, with the using of long-distance potentials of the Cu-Pt and Cu-Cu pair interactions, allows estimating the energy of copper adsorption at different structure elements of the substrate (steps, kinks, terraces) and revealing the succession of the adatom monolayer formation; it also provides additional information for the identifying of the nature of voltametric peaks for different stages of the copper adsorption-desorption. |
doi_str_mv | 10.1134/S1023193508060104 |
format | article |
fullrecord | <record><control><sourceid>crossref_sprin</sourceid><recordid>TN_cdi_crossref_primary_10_1134_S1023193508060104</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>10_1134_S1023193508060104</sourcerecordid><originalsourceid>FETCH-LOGICAL-c288t-76ba63bc94fba3135219c5e587f5402be4689e615bb1c7aa57fdc176690577793</originalsourceid><addsrcrecordid>eNp9kE9LxDAQxYMouK5-AG856qGaaZqk9SaL_2BFRT2XNJ1uu7ZJSdKD394u603wNI9583sMj5BzYFcAPLt-B5ZyKLhgOZMMWHZAFiBZnnCepYeznu1k5x-TkxC2jLFcQbEg5TOaVtsuDNQ11LhxRE8nW6MfXUQbO93TGkcXutg5S3Wkr_Gi_eovE-zRRO9qDDf0bdI2TkNiWhw6MyPDvO_7zm5OyVGj-4Bnv3NJPu_vPlaPyfrl4Wl1u05MmucxUbLSklemyJpKc-AihcIIFLlqRMbSCjOZFyhBVBUYpbVQTW1ASVkwoZQq-JLAPtd4F4LHphx9N2j_XQIrdw2VfxqamXTPhPnWbtCXWzd5O7_5D_QD4gNorQ</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Mechanism of copper underpotential deposition at Pt(hkl)-electrodes: Quantum-chemical modelling</title><source>Springer Nature</source><creator>Danilov, A. I. ; Nazmutdinov, R. R. ; Zinkicheva, T. T. ; Molodkina, E. B. ; Rudnev, A. V. ; Polukarov, Yu. M. ; Feliu, J. M.</creator><creatorcontrib>Danilov, A. I. ; Nazmutdinov, R. R. ; Zinkicheva, T. T. ; Molodkina, E. B. ; Rudnev, A. V. ; Polukarov, Yu. M. ; Feliu, J. M.</creatorcontrib><description>Mechanism of copper underpotential deposition at stepped faces of platinum single crystals Pt(
hkl
) is studied using cyclic voltammetry, scanning probe microscopy, and quantum-chemical modelling. It is shown that the first stage of UPD is one-dimensional decoration of the (100)- or (110)-orientated steps, then copper monolayer forms at (111)-terraces. The final stage is the secondary step decoration. Quantum-chemical modelling, with the using of long-distance potentials of the Cu-Pt and Cu-Cu pair interactions, allows estimating the energy of copper adsorption at different structure elements of the substrate (steps, kinks, terraces) and revealing the succession of the adatom monolayer formation; it also provides additional information for the identifying of the nature of voltametric peaks for different stages of the copper adsorption-desorption.</description><identifier>ISSN: 1023-1935</identifier><identifier>EISSN: 1608-3342</identifier><identifier>DOI: 10.1134/S1023193508060104</identifier><language>eng</language><publisher>Dordrecht: SP MAIK Nauka/Interperiodica</publisher><subject>Chemistry ; Chemistry and Materials Science ; Electrochemistry ; Physical Chemistry</subject><ispartof>Russian journal of electrochemistry, 2008-06, Vol.44 (6), p.697-708</ispartof><rights>MAIK Nauka 2008</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c288t-76ba63bc94fba3135219c5e587f5402be4689e615bb1c7aa57fdc176690577793</citedby><cites>FETCH-LOGICAL-c288t-76ba63bc94fba3135219c5e587f5402be4689e615bb1c7aa57fdc176690577793</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,27924,27925</link.rule.ids></links><search><creatorcontrib>Danilov, A. I.</creatorcontrib><creatorcontrib>Nazmutdinov, R. R.</creatorcontrib><creatorcontrib>Zinkicheva, T. T.</creatorcontrib><creatorcontrib>Molodkina, E. B.</creatorcontrib><creatorcontrib>Rudnev, A. V.</creatorcontrib><creatorcontrib>Polukarov, Yu. M.</creatorcontrib><creatorcontrib>Feliu, J. M.</creatorcontrib><title>Mechanism of copper underpotential deposition at Pt(hkl)-electrodes: Quantum-chemical modelling</title><title>Russian journal of electrochemistry</title><addtitle>Russ J Electrochem</addtitle><description>Mechanism of copper underpotential deposition at stepped faces of platinum single crystals Pt(
hkl
) is studied using cyclic voltammetry, scanning probe microscopy, and quantum-chemical modelling. It is shown that the first stage of UPD is one-dimensional decoration of the (100)- or (110)-orientated steps, then copper monolayer forms at (111)-terraces. The final stage is the secondary step decoration. Quantum-chemical modelling, with the using of long-distance potentials of the Cu-Pt and Cu-Cu pair interactions, allows estimating the energy of copper adsorption at different structure elements of the substrate (steps, kinks, terraces) and revealing the succession of the adatom monolayer formation; it also provides additional information for the identifying of the nature of voltametric peaks for different stages of the copper adsorption-desorption.</description><subject>Chemistry</subject><subject>Chemistry and Materials Science</subject><subject>Electrochemistry</subject><subject>Physical Chemistry</subject><issn>1023-1935</issn><issn>1608-3342</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2008</creationdate><recordtype>article</recordtype><recordid>eNp9kE9LxDAQxYMouK5-AG856qGaaZqk9SaL_2BFRT2XNJ1uu7ZJSdKD394u603wNI9583sMj5BzYFcAPLt-B5ZyKLhgOZMMWHZAFiBZnnCepYeznu1k5x-TkxC2jLFcQbEg5TOaVtsuDNQ11LhxRE8nW6MfXUQbO93TGkcXutg5S3Wkr_Gi_eovE-zRRO9qDDf0bdI2TkNiWhw6MyPDvO_7zm5OyVGj-4Bnv3NJPu_vPlaPyfrl4Wl1u05MmucxUbLSklemyJpKc-AihcIIFLlqRMbSCjOZFyhBVBUYpbVQTW1ASVkwoZQq-JLAPtd4F4LHphx9N2j_XQIrdw2VfxqamXTPhPnWbtCXWzd5O7_5D_QD4gNorQ</recordid><startdate>20080601</startdate><enddate>20080601</enddate><creator>Danilov, A. I.</creator><creator>Nazmutdinov, R. R.</creator><creator>Zinkicheva, T. T.</creator><creator>Molodkina, E. B.</creator><creator>Rudnev, A. V.</creator><creator>Polukarov, Yu. M.</creator><creator>Feliu, J. M.</creator><general>SP MAIK Nauka/Interperiodica</general><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>20080601</creationdate><title>Mechanism of copper underpotential deposition at Pt(hkl)-electrodes: Quantum-chemical modelling</title><author>Danilov, A. I. ; Nazmutdinov, R. R. ; Zinkicheva, T. T. ; Molodkina, E. B. ; Rudnev, A. V. ; Polukarov, Yu. M. ; Feliu, J. M.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c288t-76ba63bc94fba3135219c5e587f5402be4689e615bb1c7aa57fdc176690577793</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2008</creationdate><topic>Chemistry</topic><topic>Chemistry and Materials Science</topic><topic>Electrochemistry</topic><topic>Physical Chemistry</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Danilov, A. I.</creatorcontrib><creatorcontrib>Nazmutdinov, R. R.</creatorcontrib><creatorcontrib>Zinkicheva, T. T.</creatorcontrib><creatorcontrib>Molodkina, E. B.</creatorcontrib><creatorcontrib>Rudnev, A. V.</creatorcontrib><creatorcontrib>Polukarov, Yu. M.</creatorcontrib><creatorcontrib>Feliu, J. M.</creatorcontrib><collection>CrossRef</collection><jtitle>Russian journal of electrochemistry</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Danilov, A. I.</au><au>Nazmutdinov, R. R.</au><au>Zinkicheva, T. T.</au><au>Molodkina, E. B.</au><au>Rudnev, A. V.</au><au>Polukarov, Yu. M.</au><au>Feliu, J. M.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Mechanism of copper underpotential deposition at Pt(hkl)-electrodes: Quantum-chemical modelling</atitle><jtitle>Russian journal of electrochemistry</jtitle><stitle>Russ J Electrochem</stitle><date>2008-06-01</date><risdate>2008</risdate><volume>44</volume><issue>6</issue><spage>697</spage><epage>708</epage><pages>697-708</pages><issn>1023-1935</issn><eissn>1608-3342</eissn><abstract>Mechanism of copper underpotential deposition at stepped faces of platinum single crystals Pt(
hkl
) is studied using cyclic voltammetry, scanning probe microscopy, and quantum-chemical modelling. It is shown that the first stage of UPD is one-dimensional decoration of the (100)- or (110)-orientated steps, then copper monolayer forms at (111)-terraces. The final stage is the secondary step decoration. Quantum-chemical modelling, with the using of long-distance potentials of the Cu-Pt and Cu-Cu pair interactions, allows estimating the energy of copper adsorption at different structure elements of the substrate (steps, kinks, terraces) and revealing the succession of the adatom monolayer formation; it also provides additional information for the identifying of the nature of voltametric peaks for different stages of the copper adsorption-desorption.</abstract><cop>Dordrecht</cop><pub>SP MAIK Nauka/Interperiodica</pub><doi>10.1134/S1023193508060104</doi><tpages>12</tpages></addata></record> |
fulltext | fulltext |
identifier | ISSN: 1023-1935 |
ispartof | Russian journal of electrochemistry, 2008-06, Vol.44 (6), p.697-708 |
issn | 1023-1935 1608-3342 |
language | eng |
recordid | cdi_crossref_primary_10_1134_S1023193508060104 |
source | Springer Nature |
subjects | Chemistry Chemistry and Materials Science Electrochemistry Physical Chemistry |
title | Mechanism of copper underpotential deposition at Pt(hkl)-electrodes: Quantum-chemical modelling |
url | http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-29T01%3A15%3A54IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-crossref_sprin&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Mechanism%20of%20copper%20underpotential%20deposition%20at%20Pt(hkl)-electrodes:%20Quantum-chemical%20modelling&rft.jtitle=Russian%20journal%20of%20electrochemistry&rft.au=Danilov,%20A.%20I.&rft.date=2008-06-01&rft.volume=44&rft.issue=6&rft.spage=697&rft.epage=708&rft.pages=697-708&rft.issn=1023-1935&rft.eissn=1608-3342&rft_id=info:doi/10.1134/S1023193508060104&rft_dat=%3Ccrossref_sprin%3E10_1134_S1023193508060104%3C/crossref_sprin%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c288t-76ba63bc94fba3135219c5e587f5402be4689e615bb1c7aa57fdc176690577793%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |