Heat-resistant adhesives for thermo- and tensometrics

The description of heat-resistant cold and hot-setting adhesives developed by the All-Russian Scientific Research Institute of Aviation Materials (VIAM) is presented. The organic-silicon rubber or epoxy-organic-silicon resin are used as a binder for the cold-setting adhesives, and the phenol-organic...

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Bibliographic Details
Published in:Polymer science. Series D, Glues and sealing materials Glues and sealing materials, 2010, Vol.3 (4), p.249-251
Main Authors: Lukina, N. F., Petrova, A. P., Kotova, E. V.
Format: Article
Language:English
Subjects:
Chemistry
Chemistry and Materials Science
Polymer Sciences
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Summary:The description of heat-resistant cold and hot-setting adhesives developed by the All-Russian Scientific Research Institute of Aviation Materials (VIAM) is presented. The organic-silicon rubber or epoxy-organic-silicon resin are used as a binder for the cold-setting adhesives, and the phenol-organic-silicon resin and a mixture of inorganic compounds are used as a binder for the hot-setting adhesives. The range of operational temperatures for adhesive joints is determined. It is shown that the presented adhesives can be used to fix different sensors.
ISSN:1995-4212
1995-4220
DOI:10.1134/S1995421210040088