Diffusion Bonding of Y-Ba-Cu-O High-T c Superconductors

Diffusion bonding of Y-Ba-Cu-O ceramics without insert materials was accomplished under the conditions in which bonding temperatures ranged from 1173 K to 1223 K and bonding times were longer than 4 h. It resulted in T c and shear strength of the bonded joints which were almost identical to those of...

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Bibliographic Details
Published in:Japanese Journal of Applied Physics 1989-06, Vol.28 (6A), p.L959
Main Authors: Mutoh, Yoshiharu, Ebihara, Takashi, Aizawa, Takeshi
Format: Article
Language:English
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Summary:Diffusion bonding of Y-Ba-Cu-O ceramics without insert materials was accomplished under the conditions in which bonding temperatures ranged from 1173 K to 1223 K and bonding times were longer than 4 h. It resulted in T c and shear strength of the bonded joints which were almost identical to those of the bulk.
ISSN:0021-4922
1347-4065
DOI:10.1143/JJAP.28.L959