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Photobleaching process in polysilane films
The thermally assisted photoscission model has been formulated to explain the photobleaching of polysilane films due to the photoinduced annihilation of σ bonds. In the model, σ bonds are photoexcited and then scissored with thermal assistance, and the photobleaching by means of a prolonged exposure...
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Published in: | Japanese Journal of Applied Physics 1996-07, Vol.35 (7), p.4096-4100 |
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Main Authors: | , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | The thermally assisted photoscission model has been formulated to explain the photobleaching of polysilane films due to the photoinduced annihilation of σ bonds. In the model, σ bonds are photoexcited and then scissored with thermal assistance, and the photobleaching by means of a prolonged exposure to ultraviolet light leads to the formation of a sponge-like structure. The model predicts that (i) the decay of the photon flux absorbed in the films after
t
T
, defined as the time when the transmittance of the films begins to increase significantly, obeys a power law with an exponent of γ=
k
T
/
ε
0
, where
ε
0
is the exponential width of the activation-energy distribution and
k
T
is the thermal energy; (ii)
t
T
is inversely proportional to the incident photon flux and obeys a power law against the film thickness with an exponent of 1/γ; and (iii) the temperature dependence of
t
T
provides the cross section of the photoexcitation of σ bonds
C
r
. It has been confirmed that these predictions are fairly consistent with the experimental results. The parameters of
ε
0
and
C
r
for the photobleaching of poly(methylphenylsilane) films by 325 nm light have also been estimated to be 28 meV and 1.1×10
-16
cm
2
, respectively. |
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ISSN: | 0021-4922 1347-4065 |
DOI: | 10.1143/jjap.35.4096 |