Physical and Barrier Properties of Plasma Enhanced Chemical Vapor Deposition α-SiC:N:H Films

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Published in:Japanese Journal of Applied Physics 2003, Vol.42 (Part 1, No. 7A), p.4489-4494
Main Authors: Chiang, Chiu-Chih, Wu, Zhen-Cheng, Wu, Wei-Hao, Chen, Mao-Chieh, Ko, Chung-Chi, Chen, Hsi-Ping, Jang, Syun-Ming, Yu, Chen-Hua, Liang, Mong-Song
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container_issue Part 1, No. 7A
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container_title Japanese Journal of Applied Physics
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creator Chiang, Chiu-Chih
Wu, Zhen-Cheng
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Liang, Mong-Song
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doi_str_mv 10.1143/JJAP.42.4489
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title Physical and Barrier Properties of Plasma Enhanced Chemical Vapor Deposition α-SiC:N:H Films
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