Development of a Multi-Scale Electromigration Simulator Based on a Combination of Ultra Accelerated Quantum Chemical Molecular Dynamics and Kinetic Monte Carlo Methods Application to Cu Interconnects Lifetime Simulation

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Bibliographic Details
Published in:Japanese Journal of Applied Physics 2009-04, Vol.48 (4S), p.4
Main Authors: Tsuboi, Hideyuki, Kato, Asami, Sato, Hiromi, Hasekura, Fumie, Oda, Saori, Setogawa, Hiroshi, Abe, Chie, Chutia, Arnubhiram, Lv, Chen, Zhu, Zigang, Miura, Ryuji, Suzuki, Ai, Sahnoun, Riadh, Koyama, Michihisa, Hatakeyama, Nozomu, Endou, Akira, Takaba, Hiromitsu, Carpio, Carlos A. Del, Deka, Ramesh C., Kubo, Momoji, Miyamoto, Akira
Format: Article
Language:English
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ISSN:0021-4922
1347-4065
DOI:10.1143/JJAP.48.04C020