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Piezoelectrically Driven Dispensing Head for Encapsulation of Light Emitting Diode Chip
This study is about an amplified piezoelectric actuator driving a noncontact dispensing head. This dispensing head is mostly used for dispensing silicone encapsulants in a light emitting diode (LED) packaging process. The dispensing head using the piezoelectric actuator is capable of precisely dispe...
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Published in: | Japanese Journal of Applied Physics 2012-09, Vol.51 (9), p.09MD15-09MD15-4 |
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Main Authors: | , , , , , , |
Format: | Article |
Language: | English |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | This study is about an amplified piezoelectric actuator driving a noncontact dispensing head. This dispensing head is mostly used for dispensing silicone encapsulants in a light emitting diode (LED) packaging process. The dispensing head using the piezoelectric actuator is capable of precisely dispensing high-viscosity silicone encapsulants at a high speed. However, the multilayer piezoelectric actuator has a very tiny displacement as small as the order of 10 μm. Accordingly, a device for amplifying the displacement of multilayer piezoelectric actuators is needed. To this end, the authors designed and manufactured a displacement amplification device using a metal frame. The amplification device consists of two multilayer piezoelectric actuators and a metal frame for amplifying displacement. The amplification device has a 209 μm displacement at an input DC voltage of 150 V. The extension displacement and contraction displacement generate 9 and 10 N forces, respectively. |
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ISSN: | 0021-4922 1347-4065 |
DOI: | 10.1143/JJAP.51.09MD15 |