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Developer-induced debonding of photoresist from copper
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Published in: | IBM journal of research and development 1988-09, Vol.32 (5), p.631-635 |
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Main Authors: | , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that cite this one |
Online Access: | Get full text |
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Summary: | |
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ISSN: | 0018-8646 2151-8556 0018-8646 |
DOI: | 10.1147/rd.325.0631 |