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Developer-induced debonding of photoresist from copper

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Bibliographic Details
Published in:IBM journal of research and development 1988-09, Vol.32 (5), p.631-635
Main Authors: RUOFF, A. L, KRAMER, E. J, CHE-YU LI
Format: Article
Language:English
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ISSN:0018-8646
2151-8556
0018-8646
DOI:10.1147/rd.325.0631