(Invited) Cu Surface Passivation with Self-Assembled Monolayer (SAM) and Its Application for Wafer Bonding at Moderately Low Temperature

In this paper, low temperature (

Saved in:
Bibliographic Details
Main Authors: Tan, Chuan Seng, Lim, Dau Fatt
Format: Conference Proceeding
Language:English
Citations: Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:In this paper, low temperature (
ISSN:1938-5862
1938-6737
DOI:10.1149/05007.0115ecst