(Invited) Copper Pillar Bumping Technology-the Promising Ecosystem Changer

Copper Pillar Bump (CPB) has become increasing popular during the past 2 years with the OSATs because of the finer pitch and higher electrical performance requirements. CPBs were primarily used in flip chip on leadframe packages of power ICs in early 2003. Nowadays, the mentioned CPB actually specif...

Full description

Saved in:
Bibliographic Details
Main Authors: Guo, Hong-Yan, Zhang, Li, Tan, Kim-Hwee, Lai, Chi-Ming
Format: Conference Proceeding
Language:English
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Copper Pillar Bump (CPB) has become increasing popular during the past 2 years with the OSATs because of the finer pitch and higher electrical performance requirements. CPBs were primarily used in flip chip on leadframe packages of power ICs in early 2003. Nowadays, the mentioned CPB actually specified to its fine pitch flip chip on substrate application. In this paper, the CPB manufacture process flow was illustrated, the bumping process key point and the subsequent assembly and reliability issues were discussed. Also, the CPB patent issue and the potential effects on the OSAT especially for China domestic companies were further discussed.
ISSN:1938-5862
1938-6737
DOI:10.1149/06001.0759ecst