Accuracy and Uph Challenges and Solutions in Flip Chip Underfill Dispensing

Flip chip configurations have changed in terms of both their package design and packaging process. These emerging flip chips have become more popular now. Compared to traditional ones, the new flip chips need different dispensing approaches to improve unit-per-hour production, and require more accur...

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Bibliographic Details
Main Author: Morita, Akira
Format: Conference Proceeding
Language:English
Online Access:Get full text
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Summary:Flip chip configurations have changed in terms of both their package design and packaging process. These emerging flip chips have become more popular now. Compared to traditional ones, the new flip chips need different dispensing approaches to improve unit-per-hour production, and require more accurate fluid dispensing. Newly developed motion control and stiffer platforms for automatic fluid dispensers have addressed the challenges. This paper shows how the new system achieved significant improvements for both: 27% UPH improvement in packaging a certain flip chip configuration and +/-40um line dispensing accuracy for a few hundred micron tighter clearance from die edge.
ISSN:1938-5862
1938-6737
DOI:10.1149/06001.0805ecst