Adhesion Energy and Bonding Wave Velocity Measurements

Adhesion energy and bonding wave velocity are key parameters that should be controlled in an industrial direct bonding process because it reports what exactly occurs at the time of the bonding. While dynamics of the bonding front has been analytically studied and modelled [1-4], the literature gives...

Full description

Saved in:
Bibliographic Details
Main Authors: Larrey, Vincent, Mauguen, Gaelle, Fournel, Frank, Radisson, Damien, Rieutord, François, Morales, Christophe, Bridoux, Claudine, Moriceau, Hubert
Format: Conference Proceeding
Language:English
Citations: Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Adhesion energy and bonding wave velocity are key parameters that should be controlled in an industrial direct bonding process because it reports what exactly occurs at the time of the bonding. While dynamics of the bonding front has been analytically studied and modelled [1-4], the literature gives not much information about its characterization. This study is then focused on adhesion energy (Ea) and bonding wave velocity (Vo) measurement. After considerations about immediate and stabilized adhesion energy, we will show the dependence between Ea and Vo and we will confirm Rieutord's model [1] for hydrophilic direct bonding. Roughness dependence, plasma pre-treatment, hydrophobic direct bonding and re-bonding will also be discussed.
ISSN:1938-5862
1938-6737
DOI:10.1149/07509.0145ecst