(Invited) Self-Healing Interconnects for Reliable Flexible Electronics

In order to build flexible electronic systems that can bend in two directions simultaneously, it is required that the substrate be able to stretch easily. This is achieved by the use of elastomeric substrates. Stretchable and bendable electronics reduces the reliability of the interconnect. Factors...

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Bibliographic Details
Published in:ECS transactions 2018-01, Vol.85 (13), p.825-831
Main Authors: Parab, Virendra, Ding, Li, Kumar, Amit, Yaswant, Vaddi, Sambandan, Sanjiv
Format: Article
Language:English
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Summary:In order to build flexible electronic systems that can bend in two directions simultaneously, it is required that the substrate be able to stretch easily. This is achieved by the use of elastomeric substrates. Stretchable and bendable electronics reduces the reliability of the interconnect. Factors such as stretching, electrostatic discharge, interaction with the environment etc. increases the chance of interconnect failure due to open circuit faults. This paper describes a mechanism of self-healing open circuit faults by the use of a dispersion of conductive particles in an insulating fluid. Faults are typically repaired in 10s with the heal having a resistance of 10 Ohm-1000 Ohm. The paper provides an overview and the operational limits that determine the feasibility of using the technique to improve interconnect reliability in flexible electronics.
ISSN:1938-5862
1938-6737
1938-6737
1938-5862
DOI:10.1149/08513.0825ecst