The Role of Wafer Edge in Wafer Bonding Technologies

Wafer bonding is an important process step in microsystem technologies for processing engineered substrates and for capping. Usually the work and literature are focused on the bonding of the main wafer area. However, in recent years MEMS technologies have become more complex, with more process steps...

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Bibliographic Details
Published in:ECS transactions 2020-09, Vol.98 (4), p.103-114
Main Authors: Knechtel, Roy, Schwarz, Uwe, Dempwolf, Sophia, Nevin, Andy, Klingner, Holger, Lindemann, Gunnar, Schikowski, Marc
Format: Article
Language:English
Online Access:Get full text
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Summary:Wafer bonding is an important process step in microsystem technologies for processing engineered substrates and for capping. Usually the work and literature are focused on the bonding of the main wafer area. However, in recent years MEMS technologies have become more complex, with more process steps after wafer bonding. Accordingly, the wafer edge is becoming more and more important, and must be engineered. Methods for realizing this are discussed in this paper.
ISSN:1938-5862
1938-6737
DOI:10.1149/09804.0103ecst