The Role of Wafer Edge in Wafer Bonding Technologies

Wafer bonding is an important process step in microsystem technologies for processing engineered substrates and for capping. Usually the work and literature are focused on the bonding of the main wafer area. However, in recent years MEMS technologies have become more complex, with more process steps...

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Published in:ECS transactions 2020-09, Vol.98 (4), p.103-114
Main Authors: Knechtel, Roy, Schwarz, Uwe, Dempwolf, Sophia, Nevin, Andy, Klingner, Holger, Lindemann, Gunnar, Schikowski, Marc
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container_issue 4
container_start_page 103
container_title ECS transactions
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creator Knechtel, Roy
Schwarz, Uwe
Dempwolf, Sophia
Nevin, Andy
Klingner, Holger
Lindemann, Gunnar
Schikowski, Marc
description Wafer bonding is an important process step in microsystem technologies for processing engineered substrates and for capping. Usually the work and literature are focused on the bonding of the main wafer area. However, in recent years MEMS technologies have become more complex, with more process steps after wafer bonding. Accordingly, the wafer edge is becoming more and more important, and must be engineered. Methods for realizing this are discussed in this paper.
doi_str_mv 10.1149/09804.0103ecst
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title The Role of Wafer Edge in Wafer Bonding Technologies
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