Solution delivery of Cu(hfac)2 for alcohol-assisted chemical vapor deposition of copper

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Bibliographic Details
Published in:Journal of the Electrochemical Society 1999-03, Vol.146 (3), p.1041-1045
Main Authors: BORGHARKAR, N. S, GRIFFIN, G. L, HUI FAN, MAVERICK, A. W
Format: Article
Language:English
Subjects:
Applied sciences
Chemical vapor deposition (including plasma-enhanced cvd, mocvd, etc.)
Cross-disciplinary physics: materials science
rheology
Exact sciences and technology
Materials science
Metals. Metallurgy
Methods of deposition of films and coatings
film growth and epitaxy
Physics
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ISSN:0013-4651
1945-7111
DOI:10.1149/1.1391718