Investigating Slurry transport beneath a wafer during chemical mechanical polishing processes

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Bibliographic Details
Published in:Journal of the Electrochemical Society 2000-05, Vol.147 (5), p.1903-1909
Main Authors: COPPETA, J, ROGERS, C, RACZ, L, PHILIPOSSIAN, A, KAUFMAN, F. B
Format: Article
Language:English
Subjects:
Cross-disciplinary physics: materials science
rheology
Exact sciences and technology
Materials science
Physics
Polishing
Surface treatments
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ISSN:0013-4651
1945-7111
DOI:10.1149/1.1393455