Additive behavior during copper electrodeposition in solutions containing Cl-, PEG, and SPS

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Bibliographic Details
Published in:Journal of the Electrochemical Society 2003, Vol.150 (6), p.C420-C425
Main Authors: MIN TAN, HARB, John N
Format: Article
Language:English
Subjects:
Cross-disciplinary physics: materials science
rheology
Electrodeposition, electroplating
Exact sciences and technology
Materials science
Methods of deposition of films and coatings
film growth and epitaxy
Physics
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ISSN:0013-4651
1945-7111
DOI:10.1149/1.1570412