Low-temperature out-diffusion of Cu from silicon wafers

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Bibliographic Details
Published in:Journal of the Electrochemical Society 1996-06, Vol.143 (6), p.2025-2029
Main Authors: SHABANI, M. B, YOSHIMI, T, ABE, H
Format: Article
Language:English
Subjects:
Condensed matter: structure, mechanical and thermal properties
Cross-disciplinary physics: materials science
rheology
Diffusion in solids
Diffusion of impurities
Exact sciences and technology
Materials science
Physics
Surface cleaning, etching, patterning
Surface treatments
Transport properties of condensed matter (nonelectronic)
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Online Access:Get full text
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Description
Summary:
ISSN:0013-4651
1945-7111
DOI:10.1149/1.1836943