Post Plasma Etch Residue Removal Using CO[sub 2]-Based Mixtures: Mechanistic Considerations

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Bibliographic Details
Published in:Journal of the Electrochemical Society 2005, Vol.152 (10), p.G757
Main Authors: Myneni, Satyanarayana, Hess, Dennis W.
Format: Article
Language:English
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ISSN:0013-4651
DOI:10.1149/1.2007147