Some factors affecting hillock formation due to PECVD processing of sputtered Al-4% Cu-1% Si films

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Bibliographic Details
Published in:Journal of the Electrochemical Society 1992, Vol.139 (1), p.271-275
Main Authors: MINKIEWICZ, V. J, MOORE, J. O, ELDRIDGE, J. M
Format: Article
Language:English
Subjects:
Applied sciences
Condensed matter: structure, mechanical and thermal properties
Exact sciences and technology
Metals. Metallurgy
Physics
Solid surfaces and solid-solid interfaces
Surface and interface dynamics and vibrations
Surfaces and interfaces
thin films and whiskers (structure and nonelectronic properties)
Thin film structure and morphology
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ISSN:0013-4651
1945-7111
DOI:10.1149/1.2069183