Electroless and Electrodeposition of Tin on Gold Surfaces Sputtered onto Aluminum Nitride Substrates: A Comparison

The experimental results obtained on electroless and electrodeposition of tin on gold surfaces sputtered onto aluminum nitride substrates are comparatively discussed. Electroless deposition of tin on gold surfaces sputtered onto AlN substrates was carried out from a solution containing NaOH. While i...

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Bibliographic Details
Main Author: Djokic, Stojan
Format: Conference Proceeding
Language:English
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Summary:The experimental results obtained on electroless and electrodeposition of tin on gold surfaces sputtered onto aluminum nitride substrates are comparatively discussed. Electroless deposition of tin on gold surfaces sputtered onto AlN substrates was carried out from a solution containing NaOH. While it resulted in tin coatings with a desirable thickness, uniform appearance and a desirable surface morphology, problems related to the dissolution of aluminum nitride in alkaline solutions were observed during the course of work. The solderability of the electroless deposited tin onto gold surfaces was excellent. To overcome problems related to the dissolution of aluminum nitride in strong alkaline solutions, the future work was concentrated to the electrodeposition of tin from various solutions. The successful results were obtained with tin borofluoride solutions. The conditions leading to a production of a uniform tin coating with excellent solderabilty were determined.
ISSN:1938-5862
1938-6737
DOI:10.1149/1.2214629