Process Technology for High-Resolution AM-PLED Displays on Flexible Metal Foil Substrates

The first successful integration of poly-Si thin-film- transistor (poly-Si TFT) backplane with polymer light-emitting diodes (PLEDs) onto a flexible stainless-steel foil is described, and a high-resolution (230 DPI) monochrome active- matrix polymer light-emitting diode (AM-PLED) display is demonstr...

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Bibliographic Details
Main Authors: Chuang, Ta-Ko, Troccoli, Matias, Kuo, Po-Chin, Jamshidi Roudbari, Abbas, Hatalis, Miltiadis, Spirko, Jeffery, Klier, Kamil, Biaggio, Ivan, Voutsas, Apostolos T., Afentakis, Themis, Hartzell, John
Format: Conference Proceeding
Language:English
Online Access:Get full text
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Summary:The first successful integration of poly-Si thin-film- transistor (poly-Si TFT) backplane with polymer light-emitting diodes (PLEDs) onto a flexible stainless-steel foil is described, and a high-resolution (230 DPI) monochrome active- matrix polymer light-emitting diode (AM-PLED) display is demonstrated. The process technology required to implement this high-resolution AM-PLED display onto a flexible metal foil substrate is discussed. This technology primarily consists of the preparation of flexible metal foils, fabrication of the poly-Si TFT backplane, and integration with top-emitting PLEDs.
ISSN:1938-5862
1938-6737
DOI:10.1149/1.2356373