Process Technology for High-Resolution AM-PLED Displays on Flexible Metal Foil Substrates

The first successful integration of poly-Si thin-film- transistor (poly-Si TFT) backplane with polymer light-emitting diodes (PLEDs) onto a flexible stainless-steel foil is described, and a high-resolution (230 DPI) monochrome active- matrix polymer light-emitting diode (AM-PLED) display is demonstr...

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Main Authors: Chuang, Ta-Ko, Troccoli, Matias, Kuo, Po-Chin, Jamshidi Roudbari, Abbas, Hatalis, Miltiadis, Spirko, Jeffery, Klier, Kamil, Biaggio, Ivan, Voutsas, Apostolos T., Afentakis, Themis, Hartzell, John
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container_start_page 349
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creator Chuang, Ta-Ko
Troccoli, Matias
Kuo, Po-Chin
Jamshidi Roudbari, Abbas
Hatalis, Miltiadis
Spirko, Jeffery
Klier, Kamil
Biaggio, Ivan
Voutsas, Apostolos T.
Afentakis, Themis
Hartzell, John
description The first successful integration of poly-Si thin-film- transistor (poly-Si TFT) backplane with polymer light-emitting diodes (PLEDs) onto a flexible stainless-steel foil is described, and a high-resolution (230 DPI) monochrome active- matrix polymer light-emitting diode (AM-PLED) display is demonstrated. The process technology required to implement this high-resolution AM-PLED display onto a flexible metal foil substrate is discussed. This technology primarily consists of the preparation of flexible metal foils, fabrication of the poly-Si TFT backplane, and integration with top-emitting PLEDs.
doi_str_mv 10.1149/1.2356373
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title Process Technology for High-Resolution AM-PLED Displays on Flexible Metal Foil Substrates
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