XPS-study of Cu/epoxy Interfaces after different Wet Chemical Treatments

In microelectronics build-up technology interfaces are realized between a polymer and a metal. The peel force is a measure for the quality of the adhesion. To improve adhesion between epoxy and electrochemically deposited copper, the polymer is generally pretreated with wet-chemical sweller and oxid...

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Bibliographic Details
Published in:ECS transactions 2007-09, Vol.6 (8), p.141-152
Main Authors: Siau, Sam, De Roo, Bert, Vervaet, Alfons A.
Format: Article
Language:English
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Summary:In microelectronics build-up technology interfaces are realized between a polymer and a metal. The peel force is a measure for the quality of the adhesion. To improve adhesion between epoxy and electrochemically deposited copper, the polymer is generally pretreated with wet-chemical sweller and oxidizing treatments. It was shown that peel force is strongly dependent on the pretreatment conditions. This paper concerns different sweller and oxidizer treatment times for the epoxy. Copper is deposited by an electroless/electrogalvanic plating process. Before Cu-deposition and after peel force measurements, the obtained surface of the epoxy and the Cu-strips are studied with XPS. Atomic percentages of O, C, N, Cu, Pd and Sn are measured and the spectra are deconvoluted. Based on these results confirmations are presented for the proposed pore development in epoxy polymers due to wet chemical treatments (sweller and oxidizer). Between the XPS-results, peel force and AFM roughness measurements, correlations are presented.
ISSN:1938-5862
1938-6737
DOI:10.1149/1.2794461