Two Cryogenic Processes Involving SF[sub 6], O[sub 2], and SiF[sub 4] for Silicon Deep Etching

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Bibliographic Details
Published in:Journal of the Electrochemical Society 2008, Vol.155 (3), p.D187
Main Authors: Tillocher, T., Dussart, R., Overzet, L. J., Mellhaoui, X., Lefaucheux, P., Boufnichel, M., Ranson, P.
Format: Article
Language:eng ; jpn
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ISSN:0013-4651
DOI:10.1149/1.2826280