Clean and Conductive Wafer Bonding for MEMS

Various categories of bonding technologies were investigated for MEMS encapsulation applications. The bonding processes presented in this paper include Al to Al, Si to Si, and metal (Al or Au) to Si. Among the above different bonding schemes, the Al to Al bonding gave the highest process yield and b...

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Bibliographic Details
Main Authors: Yun, Changhan H., Martin, Jack, Chen, L, Frey, T. J.
Format: Conference Proceeding
Language:English
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Summary:Various categories of bonding technologies were investigated for MEMS encapsulation applications. The bonding processes presented in this paper include Al to Al, Si to Si, and metal (Al or Au) to Si. Among the above different bonding schemes, the Al to Al bonding gave the highest process yield and bond strength. In addition, actual MEMS accelerometers were successfully integrated with Al to Al bonding with high yield all the way through plastic over-mold packaging and assembly.
ISSN:1938-5862
1938-6737
DOI:10.1149/1.2982860