Numerical and Experimental Investigation of Thermomechanical Deformation in High-Aspect-Ratio Electroplated Through-Silicon Vias

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Bibliographic Details
Published in:Journal of the Electrochemical Society 2008, Vol.155 (12), p.H981
Main Authors: Dixit, Pradeep, Yaofeng, Sun, Miao, Jianmin, Pang, John H. L., Chatterjee, Ritwik, Tummala, Rao R.
Format: Article
Language:English
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ISSN:0013-4651
DOI:10.1149/1.2994154