Numerical and Experimental Investigation of Thermomechanical Deformation in High-Aspect-Ratio Electroplated Through-Silicon Vias

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Published in:Journal of the Electrochemical Society 2008, Vol.155 (12), p.H981
Main Authors: Dixit, Pradeep, Yaofeng, Sun, Miao, Jianmin, Pang, John H. L., Chatterjee, Ritwik, Tummala, Rao R.
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cited_by cdi_FETCH-LOGICAL-c295t-190098da7bd2ffdf1a70a67c270b9ca6c4065fa5472e36193f86bb2a54d071883
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container_end_page
container_issue 12
container_start_page H981
container_title Journal of the Electrochemical Society
container_volume 155
creator Dixit, Pradeep
Yaofeng, Sun
Miao, Jianmin
Pang, John H. L.
Chatterjee, Ritwik
Tummala, Rao R.
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doi_str_mv 10.1149/1.2994154
format article
fullrecord <record><control><sourceid>crossref</sourceid><recordid>TN_cdi_crossref_primary_10_1149_1_2994154</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>10_1149_1_2994154</sourcerecordid><originalsourceid>FETCH-LOGICAL-c295t-190098da7bd2ffdf1a70a67c270b9ca6c4065fa5472e36193f86bb2a54d071883</originalsourceid><addsrcrecordid>eNotkDFPwzAQhT2ARCkM_IOsDCm-xInjsSqFVqpAgsIaXRy7MUriyE4RbP3puLTT3fvu3kn3CLkDOgNg4gFmiRAMMnZBJpRCGrM8gyty7f1XkFAwPiGHl32nnJHYRtjX0fJnCKpT_RjAuv9WfjQ7HI3tI6ujbaNcZzslG-z_LY9KW9ed5qaPVmbXxHM_KDnGb0caLdvQOzu0OKo6-J3dh5V30xoZLJ8G_Q251Nh6dXuuU_LxtNwuVvHm9Xm9mG9imYhsjEFQKooaeVUnWtcakFPMuUw4rYTEXDKaZxozxhOV5iBSXeRVlQRQUw5FkU7J_emudNZ7p3Q5hEfR_ZZAy2NcJZTnuNI_dwxhNw</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Numerical and Experimental Investigation of Thermomechanical Deformation in High-Aspect-Ratio Electroplated Through-Silicon Vias</title><source>Institute of Physics:Jisc Collections:IOP Publishing Read and Publish 2024-2025 (Reading List)</source><creator>Dixit, Pradeep ; Yaofeng, Sun ; Miao, Jianmin ; Pang, John H. L. ; Chatterjee, Ritwik ; Tummala, Rao R.</creator><creatorcontrib>Dixit, Pradeep ; Yaofeng, Sun ; Miao, Jianmin ; Pang, John H. L. ; Chatterjee, Ritwik ; Tummala, Rao R.</creatorcontrib><identifier>ISSN: 0013-4651</identifier><identifier>DOI: 10.1149/1.2994154</identifier><language>eng</language><ispartof>Journal of the Electrochemical Society, 2008, Vol.155 (12), p.H981</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c295t-190098da7bd2ffdf1a70a67c270b9ca6c4065fa5472e36193f86bb2a54d071883</citedby><cites>FETCH-LOGICAL-c295t-190098da7bd2ffdf1a70a67c270b9ca6c4065fa5472e36193f86bb2a54d071883</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,4024,27923,27924,27925</link.rule.ids></links><search><creatorcontrib>Dixit, Pradeep</creatorcontrib><creatorcontrib>Yaofeng, Sun</creatorcontrib><creatorcontrib>Miao, Jianmin</creatorcontrib><creatorcontrib>Pang, John H. L.</creatorcontrib><creatorcontrib>Chatterjee, Ritwik</creatorcontrib><creatorcontrib>Tummala, Rao R.</creatorcontrib><title>Numerical and Experimental Investigation of Thermomechanical Deformation in High-Aspect-Ratio Electroplated Through-Silicon Vias</title><title>Journal of the Electrochemical Society</title><issn>0013-4651</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2008</creationdate><recordtype>article</recordtype><recordid>eNotkDFPwzAQhT2ARCkM_IOsDCm-xInjsSqFVqpAgsIaXRy7MUriyE4RbP3puLTT3fvu3kn3CLkDOgNg4gFmiRAMMnZBJpRCGrM8gyty7f1XkFAwPiGHl32nnJHYRtjX0fJnCKpT_RjAuv9WfjQ7HI3tI6ujbaNcZzslG-z_LY9KW9ed5qaPVmbXxHM_KDnGb0caLdvQOzu0OKo6-J3dh5V30xoZLJ8G_Q251Nh6dXuuU_LxtNwuVvHm9Xm9mG9imYhsjEFQKooaeVUnWtcakFPMuUw4rYTEXDKaZxozxhOV5iBSXeRVlQRQUw5FkU7J_emudNZ7p3Q5hEfR_ZZAy2NcJZTnuNI_dwxhNw</recordid><startdate>2008</startdate><enddate>2008</enddate><creator>Dixit, Pradeep</creator><creator>Yaofeng, Sun</creator><creator>Miao, Jianmin</creator><creator>Pang, John H. L.</creator><creator>Chatterjee, Ritwik</creator><creator>Tummala, Rao R.</creator><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>2008</creationdate><title>Numerical and Experimental Investigation of Thermomechanical Deformation in High-Aspect-Ratio Electroplated Through-Silicon Vias</title><author>Dixit, Pradeep ; Yaofeng, Sun ; Miao, Jianmin ; Pang, John H. L. ; Chatterjee, Ritwik ; Tummala, Rao R.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c295t-190098da7bd2ffdf1a70a67c270b9ca6c4065fa5472e36193f86bb2a54d071883</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2008</creationdate><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Dixit, Pradeep</creatorcontrib><creatorcontrib>Yaofeng, Sun</creatorcontrib><creatorcontrib>Miao, Jianmin</creatorcontrib><creatorcontrib>Pang, John H. L.</creatorcontrib><creatorcontrib>Chatterjee, Ritwik</creatorcontrib><creatorcontrib>Tummala, Rao R.</creatorcontrib><collection>CrossRef</collection><jtitle>Journal of the Electrochemical Society</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Dixit, Pradeep</au><au>Yaofeng, Sun</au><au>Miao, Jianmin</au><au>Pang, John H. L.</au><au>Chatterjee, Ritwik</au><au>Tummala, Rao R.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Numerical and Experimental Investigation of Thermomechanical Deformation in High-Aspect-Ratio Electroplated Through-Silicon Vias</atitle><jtitle>Journal of the Electrochemical Society</jtitle><date>2008</date><risdate>2008</risdate><volume>155</volume><issue>12</issue><spage>H981</spage><pages>H981-</pages><issn>0013-4651</issn><doi>10.1149/1.2994154</doi></addata></record>
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ispartof Journal of the Electrochemical Society, 2008, Vol.155 (12), p.H981
issn 0013-4651
language eng
recordid cdi_crossref_primary_10_1149_1_2994154
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title Numerical and Experimental Investigation of Thermomechanical Deformation in High-Aspect-Ratio Electroplated Through-Silicon Vias
url http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-08T03%3A12%3A22IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-crossref&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Numerical%20and%20Experimental%20Investigation%20of%20Thermomechanical%20Deformation%20in%20High-Aspect-Ratio%20Electroplated%20Through-Silicon%20Vias&rft.jtitle=Journal%20of%20the%20Electrochemical%20Society&rft.au=Dixit,%20Pradeep&rft.date=2008&rft.volume=155&rft.issue=12&rft.spage=H981&rft.pages=H981-&rft.issn=0013-4651&rft_id=info:doi/10.1149/1.2994154&rft_dat=%3Ccrossref%3E10_1149_1_2994154%3C/crossref%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c295t-190098da7bd2ffdf1a70a67c270b9ca6c4065fa5472e36193f86bb2a54d071883%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true