Reaction Dynamics of Activated Hydrophobic Silicon for Low-Temperature Wafer Bonding

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Bibliographic Details
Published in:Journal of the Electrochemical Society 2009, Vol.156 (5), p.H303, Article H303
Main Authors: Breninford, M. P., Colinge, C. A., Holl, S. L., Hobart, K. D., Kub, F. J.
Format: Article
Language:English
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ISSN:0013-4651
1945-7111
DOI:10.1149/1.3080639