Changing Superfilling Mode for Copper Electrodeposition in Blind Holes from Differential Inhibition to Differential Acceleration

Saved in:
Bibliographic Details
Published in:Electrochemical and solid-state letters 2009, Vol.12 (5), p.D39
Main Authors: Lühn, O., Radisic, A., Vereecken, P. M., Van Hoof, C., Ruythooren, W., Celis, J.-P.
Format: Article
Language:English
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:
ISSN:1099-0062
DOI:10.1149/1.3087790