Damage Cluster Analysis of Patterned Wafers during Solvent Spray Cleaning

As device structures become smaller they also become more fragile. With the incorporation of metal-high-k layers and shallower implants galvanic corrosion and substrate loss requirements are becoming an important issue. Aqueous chemistries are ceasing to be an option and new solvent cleans are conti...

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Main Authors: Halder, Sandip, Wostyn, Kurt L., Andreas, Michael, Wada, Masayuki, Brems, Steven, Bearda, Twan, Pacco, Antoine, Kenis, Karine, Vos, Rita, Mertens, Paul
Format: Conference Proceeding
Language:English
Online Access:Get full text
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Summary:As device structures become smaller they also become more fragile. With the incorporation of metal-high-k layers and shallower implants galvanic corrosion and substrate loss requirements are becoming an important issue. Aqueous chemistries are ceasing to be an option and new solvent cleans are continuously being experimented with. Physical force assisted solvent cleans are increasingly being considered for the removal of particles and resist residues. Whenever a physical force assisted clean is used damage becomes a major concern. In this work the effect of different solvents spray cleans on defect densities over the wafer will be discussed. The damage sites were further analyzed for clusters. The number of defects per cluster for the different solvents was also analyzed. Finally, the cluster size distribution was evaluated for the different solvents.
ISSN:1938-5862
1938-6737
DOI:10.1149/1.3202656