Atomic-Layer-Deposited Dielectric Thin Films on a Cu Clad Laminate Substrate for Embedded Metal–Insulator–Metal Capacitor Applications in Printed Circuit Boards

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Bibliographic Details
Published in:Journal of the Electrochemical Society 2011, Vol.158 (1), p.G1
Main Authors: Park, Tae Joo, Kim, Jeong Hwan, Jang, Jae Hyuck, Hwang, Cheol Seong, Kang, Hyung-Dong, Chung, Yeoul-Kyo, Oh, Yong-Soo
Format: Article
Language:English
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ISSN:0013-4651
DOI:10.1149/1.3514601