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Problems of N-type Doped Regions in Germanium, their Solutions, and How to Beat the ITRS Roadmap
In this paper the authors discuss the issues surrounding the formation of ultrashallow n-type junctions in Ge. In general the n-type dopants are relatively difficult to activate and diffuse quickly, leading to high access resistances and limited capability to reduce the device dimensions, respective...
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Main Authors: | , , , , |
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Format: | Conference Proceeding |
Language: | English |
Citations: | Items that cite this one |
Online Access: | Get full text |
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Summary: | In this paper the authors discuss the issues surrounding the formation of ultrashallow n-type junctions in Ge. In general the n-type dopants are relatively difficult to activate and diffuse quickly, leading to high access resistances and limited capability to reduce the device dimensions, respectively. Sheet resistance (Rs) was calculated for n-type box-like profiles in Si and Ge. To achieve ITRS Roadmap targets in Si an active doping concentration of 1.5-2×1020 cm-3 is required, but due to the enhanced electron mobility it is predicted approximately 6×1019 cm-3 is sufficient in Ge. |
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ISSN: | 1938-5862 1938-6737 |
DOI: | 10.1149/1.3568860 |