Superconformal Filling of Through Vias in Glass Interposers

The additive tetranitroblue tetrazolium chloride (TNBT) has been applied successfully in this work to superconformal filling (SCF) of through-vias with an aspect ratio (AR) of 6 in glass interposers (TGVs). The TGVs were initially coated with thin conformal Cu using an earlier developed hybrid metho...

Full description

Saved in:
Bibliographic Details
Published in:ECS electrochemistry letters 2014-06, Vol.3 (8), p.D30-D32
Main Authors: Ogutu, Paul, Fey, Edmond, Dimitrov, Nikolay
Format: Article
Language:English
Citations: Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:The additive tetranitroblue tetrazolium chloride (TNBT) has been applied successfully in this work to superconformal filling (SCF) of through-vias with an aspect ratio (AR) of 6 in glass interposers (TGVs). The TGVs were initially coated with thin conformal Cu using an earlier developed hybrid method. Optimization of plating parameters and bath composition led to SCF of these TGVs in only 3 h at a current density of 2.5 mA/cm2 in a stagnant bath containing 0.88M CuSO4, 40 ppm TNBT, 40 ppm Cl−, 0.1M CH3COOH, and 0.6M Na2SO4. This is the shortest reported filling time for this AR using DC plating and a single-additive system.
ISSN:2162-8726
2162-8734
DOI:10.1149/2.0081408eel