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Toughening of Epoxy Adhesives by Nanoparticles
With the emergence and commercialization of nanoparticles, new opportunities have emerged for toughening of epoxy adhesives using nanoparticles without sacrificing strength, rigidity and glass transition temperature, as is the case with conventional elastomeric tougheners. Inorganic Fullerene-like t...
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Published in: | Journal of adhesion science and technology 2009-01, Vol.23 (5), p.753-768 |
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Main Authors: | , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | With the emergence and commercialization of nanoparticles, new opportunities have emerged for toughening of epoxy adhesives using nanoparticles without sacrificing strength, rigidity and glass transition temperature, as is the case with conventional elastomeric tougheners. Inorganic
Fullerene-like tungsten disulfide (IF-WS
2
) nanoparticles and functionalized nano-POSS (Polyhedral-Oligomeric-Sil-Sesquioxane) were used to study the effects of nanoparticles on the toughening and mechanical properties of low and high temperature curing epoxy systems. Experimental
results indicated that IF-WS
2
increased the fracture toughness by more than 10 fold in both epoxy systems at very low concentrations (0.3-0.5 wt%) while increasing its storage modulus and preserving its glass transition temperature. Epoxy functionalized POSS demonstrated an
increase in toughness in addition to preserving rigidity and thermal properties at higher concentrations (3 wt%). It was postulated that chemical interaction of the sulfide and the epoxy matrix and the inherent properties of WS
2
were the decisive factors with respect to the outstanding
nano-effect in the case IF-WS
2
. |
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ISSN: | 0169-4243 1568-5616 |
DOI: | 10.1163/156856108X379209 |