Reliability Performance of Lead–Free SAC Solder Joints on Electroless Ni/Immersion Au and Electroless Ni/Electroless Pd/Immersion Au Subject to Long–Term Isothermal Aging

Saved in:
Bibliographic Details
Published in:Journal of mechatronics 2014-06, Vol.2 (2), p.100-108
Main Authors: Hai, Zhou, Zhang, Jiawei, Shen, Chaobo, Snipes, E.K., Bozack, M.J., Evans, J.L., Suhling, J.C.
Format: Article
Language:English
Citations: Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:
ISSN:2326-2885
DOI:10.1166/jom.2014.1047