Integrating copper at the nanometer length scale with Sn-3·5Ag solder to develop high performance nanocomposites

In the present study, copper at the nanometer length scale is integrated with Sn-3·5Ag using the technique of powder metallurgy incorporating energy efficient microwave sintering. Superior mechanical characteristics were realised for the formulations containing nanometer length scale copper in exces...

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Bibliographic Details
Published in:Materials science and technology 2009-10, Vol.25 (10), p.1258-1264
Main Authors: Babaghorbani, P., Nai, S. M. L., Gupta, M.
Format: Article
Language:English
Subjects:
LEAD-FREE SOLDER
MECHANICAL BEHAVIOUR
METAL MATRIX NANOCOMPOSITES
MICROWAVE SINTERING
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Summary:In the present study, copper at the nanometer length scale is integrated with Sn-3·5Ag using the technique of powder metallurgy incorporating energy efficient microwave sintering. Superior mechanical characteristics were realised for the formulations containing nanometer length scale copper in excess of 1 vol.-%. Sn-3·5Ag reinforced with 2·5 vol.% nanosize copper particulates exhibited the best overall mechanical characteristics. Particular emphasis is placed on studying the effect of the increasing presence of nanosize copper particulates on the microstructure and property evolution of the Sn-3·5Ag matrix.
ISSN:0267-0836
1743-2847
DOI:10.1179/174328408X378582