P-68: Numerical Optimization of Heat Sink Configuration for Avoiding Sound Noise Resonance in PDP PCB

• Published in: SID International Symposium Digest of technical papers 2004-05, Vol.35 (1), p.502-505
• Main Authors: Cho, Insoo, Lee, Seokyeong, Kim, Seoksan
• Format: Article
• Language: English
• ISSN: 0097-966X; 2168-0159
• DOI: 10.1889/1.1831024

PDP module mainly consists of panel and circuitries. Sound noise level in PDP module's rear side is relatively high rather than that in front side. It is due to sound noise caused from PCBs placed on rear side of PDP module. To analyze sound noise source and reduce sound noise level on PCB's of PDP module. Current wave form, voltage wave form and FFT spectrum are examined by oscilloscope and spectrum analyzer for PCB driving circuit board. Vibration frequency is measured by vibration sensor for parts on PCBs. It is found that peak frequency taken place from driver circuitry PCBs is as same as that of vibration on heat sink connected to MOSFET chip for heat dissipation of MOSFET chip on a PCB. Heat Sink is generally composed of aluminum metal and is also made large in height and area of heat dissipation to remove much more heat originated from MOSFET chip which is small in size on PCBs. Resonance noise between MOSFET chip and heat sink is enlarged much more through heat dissipation area of heat sink with a number of aluminum thin plate. Here, numerical approach of heat sink configuration is performed to avoid resonance frequency and reduce sound noise level on rear side of PDP module.