Effects of the Phosphorus Content in Ni-P substrate on Properties of Immersion Gold Coatings Obtained from Choline Chloride Solution

The effects of the phosphorus contents in electroless Ni-P substrates on the morphology, structure and corrosion resistance of gold coatings deposited on Ni-P surfaces, which were applied via a HAuCl4-ChCl gold plating solution by galvanic displacement deposition, were investigated. Compared with lo...

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Bibliographic Details
Published in:International journal of electrochemical science 2019-08, Vol.14 (8), p.8185-8194
Main Authors: Wang, Yurong, Cao, Xiaoyun, Wang, Zhiming, Chen, Zhidong, Mitsuzaki, Naotoshi
Format: Article
Language:English
Subjects:
Choline chloride
corrosion
electroless plating
phosphorus content
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Summary:The effects of the phosphorus contents in electroless Ni-P substrates on the morphology, structure and corrosion resistance of gold coatings deposited on Ni-P surfaces, which were applied via a HAuCl4-ChCl gold plating solution by galvanic displacement deposition, were investigated. Compared with low contents, high P content was not only more suitable to achieve bright golden Au surfaces, but also enabled the Ni-P coating to achieve high corrosion resistance during the immersion gold deposition process in the acidic gold plating solution and for further protection of the Cu sheet.
ISSN:1452-3981
1452-3981
DOI:10.20964/2019.08.12