Computer Chips: Stronger Ties Can Mitigate Costs

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Bibliographic Details
Published in:Inter economics 2023-09, Vol.58 (5), p.283-284
Main Authors: Freund, Caroline L, McDaniel, Christine
Format: Article
Language:English
Subjects:
China
F13
F15
F51
Halbleiter
semiconductor
Technologiepolitik
technology policy
USA
Online Access:Get full text
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ISSN:1613-964X
1613-964X
DOI:10.2478/ie-2023-0057