Bondability Investigations of Thermosonic Flip Chip Bonding Using Ultrasonic Vibration Perpendicular to the Interface

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Bibliographic Details
Published in:TRANSACTIONS OF THE JAPAN INSTITUTE OF ELECTRONICS PACKAGING 2019, Vol.12, p.E18-E18-013-7
Main Authors: Tomioka, Taizo, Shohji, Ikuo
Format: Article
Language:English
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ISSN:1883-3365
1884-8028
DOI:10.5104/jiepeng.12.E18-013-1