Bonding Abilities of Pressure-assisted Sintered Copper for Die-Bonding of Large Chips

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Bibliographic Details
Published in:TRANSACTIONS OF THE JAPAN INSTITUTE OF ELECTRONICS PACKAGING 2020, Vol.13, p.E20-E20-003-3
Main Authors: Ishikawa, Dai, An, Bao Ngoc, Mail, Matthias, Wurst, Helge, Leyrer, Benjamin, Blank, Thomas, Weber, Marc, Nakako, Hideo
Format: Article
Language:English
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ISSN:1883-3365
1884-8028
DOI:10.5104/jiepeng.13.E20-003-1