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Electromigration in Tin-bismuth Planar Solder Joints

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Bibliographic Details
Published in:	TRANSACTIONS OF THE JAPAN INSTITUTE OF ELECTRONICS PACKAGING 2024, Vol.17, p.E23-E23-008-9
Main Authors:	Singh, Prabjit, Palmer, Larry, Wassick, Thomas, Aspandiar, Raiyo, Franco, Brian, Fu, Haley, Coyle, Richard, Hadian, Faramarz, Vasudvan, Vasu, Allen, Aileen, Howell, Keith, Murayama, Kei, Zhang, Hongwen, Lifton, Anna, Ribas, Morgana, Murali, Sarangapani, Munson, Terry, Middleton, Steve
Format:	Article
Language:	English
Citations:	Items that this one cites
Online Access:	Get full text
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