Adhesion Improvement on Smooth Cu Wiring Surfaces of Printed Circuit Boards

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Bibliographic Details
Published in:TRANSACTIONS OF THE JAPAN INSTITUTE OF ELECTRONICS PACKAGING 2011, Vol.4 (1), p.24-30
Main Authors: Tani, Motoaki, Sasaki, Shinya, Uenishi, Keisuke
Format: Article
Language:English
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ISSN:1883-3365
1884-8028
DOI:10.5104/jiepeng.4.24