A High-Signal-Integrity PCB Trace Composed of Multiple Segments for GHz VLSI Packaging: Its Prototyping and Performance Analysis

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Bibliographic Details
Published in:TRANSACTIONS OF THE JAPAN INSTITUTE OF ELECTRONICS PACKAGING 2011, Vol.4 (1), p.44-51
Main Authors: Yasunaga, Moritoshi, Shimada, Hiroki, Akita, Shohei, Ishiguro, Masami, Yoshihara, Ikuo
Format: Article
Language:English
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ISSN:1883-3365
1884-8028
DOI:10.5104/jiepeng.4.44