Via Formation Process for Smooth Copper Wiring on Insulation Layer with Adhesion Layer

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Bibliographic Details
Published in:TRANSACTIONS OF THE JAPAN INSTITUTE OF ELECTRONICS PACKAGING 2013, Vol.6 (1), p.7-12
Main Authors: Sasaki, Shinya, Tani, Motoaki
Format: Article
Language:English
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ISSN:1883-3365
1884-8028
DOI:10.5104/jiepeng.6.7