Design of Via Structure for High-speed Signal Transmission in Multilayer Circuit Board

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Bibliographic Details
Published in:TRANSACTIONS OF THE JAPAN INSTITUTE OF ELECTRONICS PACKAGING 2015, Vol.8 (1), p.95-102
Main Authors: Itakura, Hiroshi, Yamagishi, Keitaro, Akeboshi, Yoshihiro
Format: Article
Language:English
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ISSN:1883-3365
1884-8028
DOI:10.5104/jiepeng.8.95