Filling of Deep-sub-µm Through Holes and Trenches by High Vacuum Planar Magnetron Sputter

The filling of deep-sub micrometer through-holes and trenches with a high aspect ratio by the high vacuum planar magnetron sputter deposition of copper, which even at pressures lower than 10−5 Pa the discharge can be sustained by the applying of a high magnetic field and high target voltage, is inve...

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Bibliographic Details
Published in:Denki kagaku oyobi kōgyō butsuri kagaku 2001/10/05, Vol.69(10), pp.769-772
Main Authors: ASAMAKI, Tatsuo, KATO, Takao, SAITO, Shigeru, KASUKAWA, Toshio, GEKA, Hayato, MOTOHASHI, Kenichi
Format: Article
Language:English
Subjects:
Deep-sub-µm Through-hole
Filling
High-vacuum Planar Magnetron Sputter
Trench
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Summary:The filling of deep-sub micrometer through-holes and trenches with a high aspect ratio by the high vacuum planar magnetron sputter deposition of copper, which even at pressures lower than 10−5 Pa the discharge can be sustained by the applying of a high magnetic field and high target voltage, is investigated. It is found that good filling is achieved in a 1% nitrogen atmosphere at a low sputter pressure of 0.1 Pa, yielding copper films with resistivity of approximately 2 × 10−8 Ωm, equivalent to that prepared by the pure argon sputter.
ISSN:1344-3542
2186-2451
DOI:10.5796/electrochemistry.69.769